COATINGS-IVD-PVD-SPUTTERING PROCESS QUESTIONNAIRE

Name (required)

Title (required)

Company (required)

Date (required)

Street, P.O. Box (required)

City, State, Country, Zip/Postal Code (required)

Phone#(required)
Office Phone#

Mobile Phone

Fax#

Email Address (required)

When Needed (required)

Price Range

Industry:(required)
SEMICONDUCTOROPTICALMETALLURGICAL
Other

Type Of Activity:
Research & Development(R&D)Production

Primary Vacuum-Controlled Atmosphere Coating Processes Desired:
Ion Vapor Deposition (IVD)Physical Vapor Deposition (PVD)Electron Beam (EB)SputteringIon Beam Assist Deposition (IBAD)Cathodic Arc Deposition (CAD)

Other

1. Film Materials/ Thicknesses (angstroms)
a. /
b. /

2. Which of these materials to be co-deposited, if any?
a.
b.

3. Substrate Material:

3a. Number of substrate sides to be coated:

4. Size of Substrates (required): inchesmillimeters
Height by Width Thickness
Diameter by Thickness

5. Estimated throughput quantity processed: /week

5a. Is this a new process for you? yesno

5b. If not a new process, what are you using now?
Make/Model

6. Above throughput on 123 shift basis

7. Temperature of substrates:
Preheatdeg. C
Duringdeg. C

8. Type of high vacuum pumping:
DiffusionCryopumpTurbomolecular
Other

9. Automated Computer Control?yesno

9a. Automatic Vacuum System control only?yesno

9b. Manual control only?yesno

10. Desired vacuum level prior to process:torr

10a. Desired vacuum level during process:torr

11.Utilities available:
VAC Phase Hz
Water – CityWater – ChilledLiquid Nitrogen
Compressed Airpsig

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